Connection interface circuit, memory storage device and signal generation method

ABSTRACT

A connection interface circuit, a memory storage device and a signal generation method are disclosed. The connection interface circuit is configured to connect a memory controller to a volatile memory module. The connection interface circuit includes a phase locking circuit, a wire module and a signal interface. The signal interface is coupled between the wire module and the memory controller. The phase locking circuit is configured to receive a first clock signal from the memory controller. The phase locking circuit is further configured to generate a second clock signal according to the first clock signal and a delay feature of the wire module. The wire module is configured to provide a third clock signal to the signal interface according to the second clock signal.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 108129899, filed on Aug. 21, 2019. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND Technical Field

The disclosure relates to a signal processing technology, and inparticular, relates to a connection interface circuit, a memory storagedevice and a signal generation method.

Description of Related Art

In general, a memory controller can access a volatile memory modulethrough a connection interface circuit. However, in order to align aclock signal provided to the volatile memory module by the connectioninterface circuit with a clock signal of the memory controller itself,normally, a delay caused by transmitting the clock signal in theconnection interface circuit can be measured first, and then an delayamount of an output signal can be iteratively adjusted by the memorycontroller according to the delay. However, in practice, due to factorslike temperature changes and/or process errors, the memory controlleroften needs to spend more time than expected to adjust the clock signal,thereby reducing an operational efficiency of the memory storage device.

Nothing herein should be construed as an admission of knowledge in theprior art of any portion of the present disclosure. Furthermore,citation or identification of any document in this application is not anadmission that such document is available as prior art to the presentdisclosure, or that any reference forms a part of the common generalknowledge in the art.

SUMMARY

The disclosure provides a connection interface circuit, a memory storagedevice and a signal generation method, which can effectively improve theoperational efficiency of the memory storage device.

An exemplary embodiment of the disclosure provides a connectioninterface circuit, which is configured to couple a memory controller toa volatile memory module. The connection interface circuit includes aphase locking circuit, a wire module and a signal interface. The phaselocking circuit is coupled to the memory controller. The wire module iscoupled to the phase locking circuit. The signal interface is coupledbetween the wire module and the memory controller. The phase lockingcircuit is configured to receive a first clock signal from the memorycontroller. The phase locking circuit is further configured to generatea second clock signal according to the first clock signal and a delayfeature of the wire module. The wire module is configured to provide athird clock signal to the signal interface according to the second clocksignal.

An exemplary embodiment of the disclosure further provides a memorystorage device, which includes a volatile memory module, a memorycontroller and a connection interface circuit. The memory interfacecircuit is coupled to the volatile memory module and the memorycontroller. The connection interface circuit is configured to receive afirst clock signal from the memory controller. The connection interfacecircuit is further configured to generate a second clock signalaccording to the first clock signal and a delay feature of a wire modulein the connection interface circuit. The connection interface circuit isfurther configured to provide a third clock signal to a signal interfacebetween the connection interface circuit and the memory controlleraccording to the second clock signal.

An exemplary embodiment of the disclosure further provides a signalgeneration method for a connection interface circuit. The connectioninterface circuit is configured to couple a memory controller to avolatile memory module. The signal generation method includes: receivinga first clock signal from the memory controller; generating a secondclock signal according to the first clock signal and a delay feature ofa wire module in the connection interface circuit; and providing a thirdclock signal to a signal interface between the connection interfacecircuit and the memory controller by the wire module according to thesecond clock signal.

Based on the above, after the connection interface circuit receives thefirst clock signal from the memory controller, the connection interfacecircuit can generate the second clock signal according to the firstclock signal and the delay feature of the wire module in the connectioninterface circuit. Then, the third clock signal is provided to thesignal interface between the connection interface circuit and the memorycontroller by the wire module according to the second clock signal. As aresult, the efficiency of signal alignment between the connectioninterface circuit and the memory controller can be effectively improved.

It should be understood, however, that this Summary may not contain allof the aspects and embodiments of the present disclosure, is not meantto be limiting or restrictive in any manner, and that the disclosure asdisclosed herein is and will be understood by those of ordinary skill inthe art to encompass obvious improvements and modifications thereto.

To make the aforementioned more comprehensible, several embodimentsaccompanied with drawings are described in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram illustrating a memory storage deviceaccording to an exemplary embodiment of the disclosure.

FIG. 2 is a timing diagram of a plurality of signals according to anexemplary embodiment of the disclosure.

FIG. 3 is a schematic diagram illustrating a phase locking circuitaccording to an exemplary embodiment of the disclosure.

FIG. 4 is an equivalent schematic diagram illustrating a compensationcircuit according to an exemplary embodiment of the disclosure.

FIG. 5 is a flowchart illustrating a signal generation method accordingto an exemplary embodiment of the disclosure.

FIG. 6 is a schematic diagram illustrating a memory storage deviceaccording to an exemplary embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

Embodiments of the present disclosure may comprise any one or more ofthe novel features described herein, including in the DetailedDescription, and/or shown in the drawings. As used herein, “at leastone”, “one or more”, and “and/or” are open-ended expressions that areboth conjunctive and disjunctive in operation. For example, each of theexpressions “at least one of A, B and C”, “at least one of A, B, or C”,“one or more of A, B, and C”, “one or more of A, B, or C” and “A, B,and/or C” means A alone, B alone, C alone, A and B together, A and Ctogether, B and C together, or A, B and C together.

It is to be noted that the term “a” or “an” entity refers to one or moreof that entity. As such, the terms “a” (or “an”), “one or more” and “atleast one” can be used interchangeably herein.

The provided exemplary embodiments can be suitably combined. The term“coupling/coupled” used in this specification (including claims) mayrefer to any direct or indirect connection means. For example, “a firstdevice is coupled to a second device” should be interpreted as “thefirst device is directly connected to the second device” or “the firstdevice is indirectly connected to the second device through otherdevices or connection means.” In addition, the term “signal” can mean acurrent, a voltage, a charge, a temperature, data or any one or multiplesignals.

FIG. 1 is a schematic diagram illustrating a memory storage deviceaccording to an exemplary embodiment of the disclosure. Referring toFIG. 1, a memory storage device 10 includes a memory controller 11, aconnection interface circuit 12 and a volatile memory module 13. Thememory controller 11, the connection interface circuit 12 and thevolatile memory module 13 may be installed on one or more circuit boardsin the memory storage device 10. The memory controller 11 supportsseparate and/or parallel data access operations for the volatile memorymodule 13.

The memory controller 11 can serve as a communication bridge between acentral processing unit (not shown) and the volatile memory module 13and can be dedicated to control the volatile memory module 13. In anexemplary embodiment, the memory controller 11 is also known as adynamic random access memory controller (DRAM controller).

The volatile memory module 13 can be used to temporarily store data. Forexample, the volatile memory module 13 may include various types ofvolatile memory modules including a DDR SDRAM (first generation DoubleData Rate Synchronous Dynamic Random Access Memory), a DDR 2 SDRAM(second generation Double Data Rate Synchronous Dynamic Random AccessMemory), a DDR 3 SDRAM (third generation Double Data Rate SynchronousDynamic Random Access Memory), a DDR 4 SDRAM (fourth generation DoubleData Rate Synchronous Dynamic Random Access Memory). Also, the number ofthe volatile memory module 13 may be one or more.

The connection interface circuit 12 is configured to connect the memorycontroller 11 to the volatile memory module 13. When data is to be readfrom the volatile memory module 13 or data is to be stored into thevolatile memory module 13, the memory controller 11 can send a controlcommand to the volatile memory module 13 through the connectioninterface circuit 12. When the control command is received by thevolatile memory module 13, the volatile memory module 13 can storewrite-data corresponding to the control command or return read-datacorresponding to the control command to the memory controller 11 throughthe connection interface circuit 12. In an exemplary embodiment, theconnection interface circuit 12 is also known as a memory interfacecircuit.

In an exemplary embodiment, the connection interface circuit 12 includesa phase locking circuit 101, a wire module 102 and a signal interface103. The phase locking circuit 101 is coupled to the memory controller11. The wire module 102 is coupled between the phase locking circuit 101and the signal interface 103. The signal interface 103 is coupledbetween the connection interface circuit 12 and the memory controller11.

In an exemplary embodiment, the phase locking circuit 101 is also knownas a phase-locked loop (PLL) circuit. The phase locking circuit 101 canreceive a clock signal (a.k.a. a first clock signal) CLK(1) from thememory controller 11. The phase locking circuit 101 can generate a clocksignal (a.k.a. a second clock signal) CLK(2) according to the clocksignal CLK(1) and a delay feature of the wire module 102. The wiremodule 102 can provide a clock signal (a.k.a. a third clock signal)CLK(3) to the signal interface 103 according to the clock signal CLK(2).

In general, a delay of the clock signal CLK(2) will occur in the processof being transmitted by the wire module 102, causing a phase differencebetween the clock signals CLK(3) and CLK(2) to shift. Therefore,conventionally, after the memory controller 11 provides the clock signalCLK(1) to the phase locking circuit 101, the memory controller 11 needsto adjust a phase of the clock signal CLK(3) provided by the wire module102 so that the phase of the clock signal CLK(3) and a phase of CLK(1)are aligned with each other. Thereafter, signals S(1) to S(24) outputtedby the memory controller 11 can be correctly cooperated with the clocksignal CLK(3) in the signal interface 103 to, for example, sample thesignals S(1) to S(24) at a correct phase. Here, the signals S(1) toS(24) may include a data signal and/or a command signal.

Traditionally, the memory controller 11 mainly adjusts the phase of theclock signal CLK(3) with a preset delay amount to initially attempt tobring the phase of the clock signal CLK(3) closer to the phase ofCLK(1). In addition, the memory controller 11 can further correct thephase of the clock signal CLK(3) in an iterative manner. However, underthe influence of temperature changes and/or process variations, suchadjustment may take more time than expected, resulting in a decrease inthe performance of the memory storage device 10.

In an exemplary embodiment, the phase locking circuit 101 can simulatethe delay feature of the wire module 102 and generate the clock signalCLK(2) according to such delay feature. For example, the phase lockingcircuit 101 can attempt to lock a phase difference between the clocksignals CLK(1) and CLK(2) at a target phase difference according to thedelay feature of the wire module 102. The target phase difference can beaffected by the delay feature of the wire module 102. Then, in theprocess of transmitting the clock signal CLK(2) to the signal interface103, the wire module 102 can delay the clock signal CLK(2) according toits own delay feature to generate the clock signal CLK(3). Inparticular, an delay amount of the clock signal CLK(2) in the wiremodule 102 corresponds to the target phase difference described above.In this way, at output terminals of the wire module 102, the phase ofthe clock signal CLK(3) and the phase of the clock signal CLK(1) can besubstantially aligned with each other. It should be noted that, theso-called “substantially aligned” may refer to “completely aligned” or“partially aligned with fractional error allowed”.

FIG. 2 is a timing diagram of a plurality of signals according to anexemplary embodiment of the disclosure. Referring to FIG. 1 and FIG. 2,the phase locking circuit 101 can delay the clock signal CLK(1)according to the delay feature of the wire module 102 to generate theclock signal CLK(2) (i.e., a first delay) so that the target phasedifference (e.g., n degrees) is generated between the clock signalsCLK(1) and CLK(2). Then, in the process of transmitting the clock signalCLK(2) to the signal interface 103, the wire module 102 can delay theclock signal CLK(2) according to its own delay feature to generate theclock signal CLK(3) (i.e., a second delay). The phase of the clocksignal CLK(3) output by the wire module 102 and the phase of the clocksignal CLK(1) can be substantially aligned with each other. In addition,the clock signal CLK(3) output by the wire module 102 can also beautomatically aligned with a signal S(i) to facilitate a subsequentanalysis of the signal S(i). The signal S(i) may be any one of thesignals S(1) to S(24) in FIG. 1.

In other words, after the first delay, the target phase difference canbe generated between the clock signals CLK(1) and CLK(2). However, afterthe second delay, the target phase difference can be recovered orremoved so that the phase of the clock signal CLK(3) and the phase ofthe clock signal CLK(1) can be substantially aligned with each other. Inan exemplary embodiment, under the influence of temperature changesand/or process variations, in response to changes in the delay featureof the wire module 102, the phase locking circuit 101 can dynamicallyadjust the target phase difference. According to the dynamicallyadjusted target phase difference, the phase of the clock signal CLK(3)can continuously be substantially aligned with the phase of the clocksignal CLK(1).

FIG. 3 is a schematic diagram illustrating a phase locking circuitaccording to an exemplary embodiment of the disclosure. Referring toFIG. 3, the phase locking circuit 101 includes a modulation circuit 31and a compensation circuit 32. The modulation circuit 31 is coupled tothe memory controller 101 and the wire module 102 of FIG. 1. Thecompensation circuit 32 is coupled to the modulation circuit 31. Themodulation circuit 31 can receive the clock signal CLK(1) and acompensation signal CS. The modulation circuit 31 can generate the clocksignal CLK(2) according to the clock signal CLK(1) and the compensationsignal CS. For example, the modulation circuit 31 can be used tocontinuously adjust (e.g., delay) the phase of the clock signal CLK(2)to reduce a phase difference between the clock signal CLK(1) and thecompensation signal CS. After reaching a steady state (e.g., a phase ofthe compensation signal CS catches up with the phase of the pulse signalCLK(1)), the modulation circuit 31 can lock the phase difference betweenthe clock signals CLK(1) and CLK(2) at the target phase difference.

In an exemplary embodiment, the modulation circuit 31 includes a phasedetector 311 and a clock output circuit 312. The phase detector 311 canreceive the clock signal CLK(1) and the compensation signal CS. Thephase detector 311 can detect the phase difference between the clocksignal CLK(1) and the compensation signal CS and generate a phasedifference signal FD. For example, the phase difference signal FD canreflect the phase difference between the clock signal CLK(1) and thecompensation signal CS. The clock output circuit 312 can receive thephase difference signal FD and generate the clock signal CLK(2)according to the phase difference signal FD. For example, the clockoutput circuit 312 may include a charge pump, a voltage controlledoscillator and/or a voltage divider. The clock output circuit 312 cancontinuously adjust the phase of the clock signal CLK(2) according tothe phase difference signal FD.

The compensation circuit 32 can generate the compensation signal CSaccording to the clock signal CLK(2). For example, the compensationcircuit 32 can simulate the delay feature of the wire module 102 anddelay the clock signal CLK(2) according to such delay feature togenerate the compensation signal CS.

FIG. 4 is an equivalent schematic diagram illustrating a compensationcircuit according to an exemplary embodiment of the disclosure.Referring to FIG. 4, taking a wire module 402 as an example, the wiremodule 402 includes connection lines L(1) to L(4) and wiring turningpoints P(1) to P(4). The wire module 402 can delay a signal at an inputterminal IN according to its own delay feature and output the delayedsignal at output terminals OUT.

A compensation circuit 42 is an equivalent circuit of the wire module402. The compensation circuit 42 can simulate the delay feature of thewire module 402. For example, the compensation circuit 42 includescircuit modules (a.k.a. first circuit modules) EL(1) to EL(4) andcircuit modules (a.k.a. second circuit modules) EP(1) to EP(4). Thecircuit modules EL(1) to EL(4) can be used to simulate delay features ofthe connection lines L(1) to L(4) in the wire module 402, respectively.The circuit modules EP(1) to EP(4) can be used to simulate delayfeatures of the wiring turning points P(1) to P(4) in the wire module402, respectively.

In an exemplary embodiment, each of the circuit modules EL(1) to EL(4)includes at least one RC circuit. As shown by FIG. 4, one RC circuit caninclude at least one resistance component and at least one capacitancecomponent. In an exemplary embodiment, each of the circuit modules EP(1)to EP(4) includes at least one buffer component. As shown by FIG. 4, onebuffer component may be a non-reversing or reversing delay component(e.g., a reversing amplifier). An delay amount generated by a signalpassing through the wire module 402 can be equal to an delay amountgenerated by the signal passing through the compensation circuit 42. Asimilar circuit design can be applied to design the compensation circuit32 of FIG. 3 to simulate the delay feature of the wire module 102 ofFIG. 1.

In an exemplary embodiment of FIG. 1 and/or FIG. 3, the phase lockingcircuit 101 and/or the clock output circuit 312 can generate the clocksignal CLK(2) with 1× frequency. That is to say, the frequency of theclock signal CLK(2) is identical to the frequency of the clock signalCLK(1). Nonetheless, in an exemplary embodiment of FIG. 1 and/or FIG. 3,the phase locking circuit 101 and/or the clock output circuit 312 canalso generate a 2× clock signal, a 4× clock signal or a clock signalwith frequency of other multiples. For example, the frequency of the 2×clock signal is 2 times the frequency of the clock signal CLK(2), thefrequency of the 4× clock signal is 4 times the frequency of the clocksignal CLK(2), and so on and so forth.

It should be noted that the schematic diagrams of the circuit structurespresented in FIG. 1, FIG. 3 and FIG. 4 are merely examples and are notintended to limit the disclosure. In other exemplary embodiments notmentioned, more electronic components may be included in the circuitstructures presented in FIG. 1, FIG. 3, and FIG. 4 to provide additionalfunctionality. Alternatively, some of the electronic components in thecircuit structure presented in FIG. 1, FIG. 3, and FIG. 4 may bereplaced by electronic components having the same or similar functions,and the disclosure is not limited thereto.

FIG. 5 is a flowchart illustrating a signal generation method accordingto an exemplary embodiment of the disclosure. Referring to FIG. 5, instep S501, a first clock signal is received from a memory controller. Instep S502, a second clock signal is generated according to the firstclock signal and a delay feature of a wire module in the connectioninterface circuit. In step S503, a third clock signal is provided to asignal interface between the connection interface circuit and the memorycontroller by the wire module according to the second clock signal.

Nevertheless, steps depicted in FIG. 5 are described in detail as aboveso that related description thereof is omitted hereinafter. It should benoted that, the steps depicted in FIG. 5 may be implemented as aplurality of program codes or circuits, which are not particularlylimited in the disclosure. Moreover, the method disclosed in FIG. 5 maybe implemented by reference with above exemplary embodiments, or may beimplemented separately, which are not particularly limited in thedisclosure.

FIG. 6 is a schematic diagram illustrating a memory storage deviceaccording to an exemplary embodiment of the disclosure. Referring toFIG. 6, a memory storage device 60 is a memory storage device includingboth a rewritable non-volatile memory module 63 and a volatile memorymodule 64, such as a SSD (Solid State Drive). The memory storage device60 can be used together with a host system so the host system can writedata into the memory storage device 60 or read data from the memorystorage device 60. For example, the mentioned host system may be anysystem capable of substantially cooperating with the memory storagedevice 60 for storing data, such as a desktop computer, a notebookcomputer, a digital camera, a video camera, a communication device, anaudio player, a video player or a tablet computer.

The memory storage device 60 includes a connection interface unit 61, amemory control circuit unit 62, the rewritable non-volatile memorymodule 63 and the volatile memory module 64. The connection interfaceunit 61 is configured to connect the memory storage device 60 to thehost system. In an exemplary embodiment, the connection interface unit61 is compatible with a SATA (Serial Advanced Technology Attachment)standard. Nevertheless, it should be understood that the disclosure isnot limited in this regard. The connection interface unit 61 may also becompatible with a PATA (Parallel Advanced Technology Attachment)standard, a PCI Express (Peripheral Component Interconnect Express)interface standard, a USB (Universal Serial Bus) standard or othersuitable standards. The connection interface unit 61 may be packagedtogether with the memory control circuit unit 62 into one chip, or theconnection interface unit 61 may also be distributed outside of a chipcontaining the memory control circuit unit 62.

The memory control circuit unit 62 is configured to perform operationsof writing, reading or erasing data in the rewritable non-volatilememory module 63 according to the control commands. For example, thememory control circuit unit 62 may include the memory controller 11 andthe connection interface circuit 12 in FIG. 1 to control the volatilememory module 64.

The rewritable non-volatile memory module 63 is coupled to the memorycontrol circuit unit 62 and configured to store data written from thehost system. The rewritable non-volatile memory module 63 may be a SLC(Single Level Cell) NAND flash memory module (i.e., a flash memorymodule capable of storing one bit in one memory cell), an MLC (MultiLevel Cell) NAND flash memory module (i.e., a flash memory modulecapable of storing two bits in one memory cell), a TLC (Triple LevelCell) NAND flash memory module (i.e., a flash memory module capable ofstoring three bits in one memory cell), a QLC (Qual Level Cell)NAND-type flash memory module (i.e., a flash memory module capable ofstoring four bits in one memory cell), other flash memory modules orother memory modules having the same features.

In summary, after the first delay of the phase locking circuit, thetarget phase difference can be generated between the first clock signaland the second clock signal. Then, after the second delay of the wiremodule, the target phase difference can be recovered or removed so thatthe phase of the third clock signal and the phase of the first clocksignal can be substantially aligned with each other. Accordingly, underthe influence of temperature changes and/or process variations, thephase of the third clock signal can continuously be substantiallyaligned with the phase of the first clock signal. As a result, theefficiency of signal alignment between the connection interface circuitand the memory controller can be effectively improved.

The previously described exemplary embodiments of the present disclosurehave the advantages aforementioned, wherein the advantagesaforementioned not required in all versions of the disclosure.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentdisclosure without departing from the scope or spirit of the disclosure.In view of the foregoing, it is intended that the present disclosurecover modifications and variations of this disclosure provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A connection interface circuit for coupling amemory controller to a volatile memory module, the connection interfacecircuit comprising: a phase locking circuit, coupled to the memorycontroller; a wire module, coupled to the phase locking circuit; and asignal interface, coupled between the wire module and the memorycontroller, wherein the phase locking circuit is configured to receive afirst clock signal from the memory controller, the phase locking circuitis further configured to generate a second clock signal according to thefirst clock signal and a delay feature of the wire module, and the wiremodule is configured to provide a third clock signal to the signalinterface according to the second clock signal.
 2. The connectioninterface circuit according to claim 1, wherein the phase lockingcircuit is further configured to lock a phase difference between thefirst clock signal and the second clock signal at a target phasedifference, and the target phase difference is affected by the delayfeature of the wire module.
 3. The connection interface circuitaccording to claim 2, wherein the wire module is further configured todelay the second clock signal to generate the third clock signal, and adelay amount of the second clock signal corresponds to the target phasedifference.
 4. The connection interface circuit according to claim 1,wherein the phase locking circuit comprises: a modulation circuit,coupled to the memory controller and the wire module; and a compensationcircuit, coupled to the modulation circuit, wherein the modulationcircuit is configured to generate the second clock signal according tothe first clock signal and a compensation signal, and the compensationcircuit is configured to generate the compensation signal according tothe second clock signal.
 5. The connection interface circuit accordingto claim 4, wherein the compensation circuit comprises: at least onefirst circuit module, configured to simulate a delay feature of at leastone connection line in the wire module; and at least one second circuitmodule, coupled to the at least one first circuit module and configuredto simulate a delay feature of at least one wiring turning point in thewire module.
 6. The connection interface circuit according to claim 5,wherein the at least one first circuit module comprises at least one RCcircuit.
 7. The connection interface circuit according to claim 5,wherein the at least one second circuit module comprises at least onebuffer component.
 8. The connection interface circuit according to claim4, wherein the modulation circuit comprises: a phase detector, coupledto the memory controller and the compensation circuit; and a clockoutput circuit, coupled to the phase detector and the wire module,wherein the phase detector is configured to detect a phase differencebetween the first clock signal and the compensation signal, and theclock output circuit is configured to generate the second clock signalaccording to the phase difference.
 9. A memory storage device,comprising: a volatile memory module; a memory controller; and aconnection interface circuit, coupled to the volatile memory module andthe memory controller, wherein the connection interface circuit isconfigured to receive a first clock signal from the memory controller,the connection interface circuit is further configured to generate asecond clock signal according to the first clock signal and a delayfeature of a wire module in the connection interface circuit, and theconnection interface circuit is further configured to provide a thirdclock signal to a signal interface between the connection interfacecircuit and the memory controller according to the second clock signal.10. The memory storage device according to claim 9, wherein theconnection interface circuit is further configured to lock a phasedifference between the first clock signal and the second clock signal ata target phase difference, and the target phase difference is affectedby the delay feature of the wire module.
 11. The memory storage deviceaccording to claim 10, wherein the connection interface circuit isfurther configured to delay the second clock signal by the wire moduleto generate the third clock signal, and a delay amount of the secondclock signal corresponds to the target phase difference.
 12. The memorystorage device according to claim 9, wherein the connection interfacecircuit comprises: a modulation circuit, coupled to the memorycontroller; and a compensation circuit, coupled to the modulationcircuit, wherein the modulation circuit is configured to generate thesecond clock signal according to the first clock signal and acompensation signal, and the compensation circuit is configured togenerate the compensation signal according to the second clock signal.13. The memory storage device according to claim 12, wherein thecompensation circuit comprises: at least one first circuit module,configured to simulate a delay feature of at least one connection linein the wire module; and at least one second circuit module, coupled tothe at least one first circuit module and configured to simulate a delayfeature of at least one wiring turning point in the wire module.
 14. Thememory storage device according to claim 13, wherein the at least onefirst circuit module comprises at least one RC circuit.
 15. The memorystorage device according to claim 13, wherein the at least one secondcircuit module comprises at least one buffer component.
 16. The memorystorage device according to claim 12, wherein the modulation circuitcomprises: a phase detector, coupled to the memory controller and thecompensation circuit; and a clock output circuit, coupled to the phasedetector and the wire module, wherein the phase detector is configuredto detect a phase difference between the first clock signal and thecompensation signal, and the clock output circuit is configured togenerate the second clock signal according to the phase difference. 17.A signal generation method for a connection interface circuit, whereinthe connection interface circuit is configured to connect a memorycontroller and a volatile memory module, and the signal generationmethod comprises: receiving a first clock signal from the memorycontroller; generating a second clock signal according to the firstclock signal and a delay feature of a wire module in the connectioninterface circuit; and providing a third clock signal to a signalinterface between the connect interface circuit and the memorycontroller by the wire module according to the second clock signal. 18.The signal generation method according to claim 17, further comprising:locking a phase difference between the first clock signal and the secondclock signal at a target phase difference, wherein the target phasedifference is affected by the delay feature of the wire module.
 19. Thesignal generation method according to claim 18, further comprising:delaying the second clock signal by the wire module to generate thethird clock signal, wherein a delay amount of the second clock signalcorresponds to the target phase difference.
 20. The signal generationmethod according to claim 17, wherein the step of generating the secondclock signal according to the first clock signal and the delay featureof the wire module in the connection interface circuit comprises:generating the second clock signal according to the first clock signaland a compensation signal; and generating the compensation signalaccording to the second clock signal.
 21. The signal generation methodaccording to claim 20, further comprising: simulating a delay feature ofat least one connection line in the wire module; and simulating a delayfeature of at least one wiring turning point in the wire module.
 22. Thesignal generation method according to claim 21, wherein the step ofsimulating the delay feature of the at least one connection line in thewire module comprises: simulating the delay feature of the at least oneconnection line in the wire module by at least one RC circuit.
 23. Thesignal generation method according to claim 21, wherein the step ofsimulating the delay feature of the at least one wiring turning point inthe wire module comprises: simulating the delay feature of the at leastone wiring turning point by at least one buffer component.
 24. Thesignal generation method according to claim 20, wherein the step ofgenerating the second clock signal according to the first clock signaland the compensation signal comprises: detecting a phase differencebetween the first clock signal and the compensation signal; andgenerating the second clock signal according to the phase difference.